PRELIMINARY DATA SHEET
512M bits DDR SDRAM
EDD5108AFBG (64M words
×
8 bits)
EDD5116AFBG (32M words
×
16 bits)
Specifications
•
Density: 512M bits
•
Organization
16M words
×
8 bits
×
4 banks (EDD5108AFBG)
8M words
×
16 bits
×
4 banks (EDD5116AFBG)
•
Package: 60-ball FBGA
Lead-free (RoHS compliant)
•
Power supply:
DDR400: VDD, VDDQ
=
2.6V
±
0.1V
DDR333: VDD, VDDQ
=
2.5V
±
0.2V
•
Data rate: 400Mbps/333Mbps (max.)
•
Four internal banks for concurrent operation
•
Interface: SSTL_2
•
Burst lengths (BL): 2, 4, 8
•
Burst type (BT):
Sequential (2, 4, 8)
Interleave (2, 4, 8)
•
/CAS Latency (CL): 2, 2.5, 3
•
Precharge: auto precharge option for each burst
access
•
Driver strength: normal/weak
•
Refresh: auto-refresh, self-refresh
•
Refresh cycles: 8192 cycles/64ms
Average refresh period: 7.8µs
•
Operating ambient temperature range
TA = 0°C to +70°C
Features
•
Double-data-rate architecture; two data transfers per
clock cycle
•
The high-speed data transfer is realized by the 2 bits
prefetch pipelined architecture
•
Bi-directional data strobe (DQS) is transmitted
/received with data for capturing data at the receiver
•
Data inputs, outputs, and DM are synchronized with
DQS
•
DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
•
Differential clock inputs (CK and /CK)
•
DLL aligns DQ and DQS transitions with CK
transitions
•
Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
•
Data mask (DM) for write data
EO
Document No. E0887E20 (Ver. 2.0)
Date Published November 2006 (K) Japan
Printed in Japan
URL: http://www.elpida.com
L
od
Pr
This product became EOL in April, 2010.
Elpida
Memory, Inc. 2006
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