EDJ1104BBSE, EDJ1108BBSE, EDJ1116BBSE
DDR3 SDRAM Mode Register 1 [MR1] ...................................................................................................... 79
DDR3 SDRAM Mode Register 2 [MR2] ...................................................................................................... 80
DDR3 SDRAM Mode Register 3 [MR3] ...................................................................................................... 81
Burst Length (MR0) .................................................................................................................................... 82
Burst Type (MR0) ....................................................................................................................................... 82
DLL Enable (MR1) ...................................................................................................................................... 83
DLL-off Mode .............................................................................................................................................. 83
DLL on/off switching procedure .................................................................................................................. 84
Additive Latency (MR1)............................................................................................................................... 86
Write Leveling (MR1) .................................................................................................................................. 87
EO
Data Sheet E1375E50 (Ver. 5.0)
TDQS, /TDQS function (MR1) .................................................................................................................... 90
Extended Temperature Usage (MR2) ......................................................................................................... 91
Multi Purpose Register (MR3)..................................................................................................................... 93
Read Timing Definition.............................................................................................................................. 101
Read Operation ........................................................................................................................................ 105
Write Timing Definition.............................................................................................................................. 112
Write Operation......................................................................................................................................... 113
Write Timing Violations ............................................................................................................................. 119
Write Data Mask ....................................................................................................................................... 120
Precharge ................................................................................................................................................. 121
Auto Precharge Operation ........................................................................................................................ 122
Auto-Refresh............................................................................................................................................. 123
Self-Refresh.............................................................................................................................................. 124
Power-Down Mode ................................................................................................................................... 125
Input Clock Frequency Change during Precharge Power-Down............................................................... 132
On-Die Termination (ODT)........................................................................................................................ 133
ZQ Calibration........................................................................................................................................... 145
Operation of the DDR3 SDRAM ................................................................................................................101
Package Drawing ......................................................................................................................................147
78-ball FBGA ............................................................................................................................................ 147
96-ball FBGA ............................................................................................................................................ 148
Recommended Soldering Conditions........................................................................................................149
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ELPIDA [ ELPIDA MEMORY ]
