DATA SHEET
1G bits DDR3 SDRAM
EDJ1104BASE (256M words
×
4 bits)
EDJ1108BASE (128M words
×
8 bits)
EDJ1116BASE (64M words
×
16 bits)
Specifications
•
Density: 1G bits
•
Organization
32M words
×
4 bits
×
8 banks (EDJ1104BASE)
16M words
×
8 bits
×
8 banks (EDJ1108BASE)
8M words
×
16 bits
×
8 banks (EDJ1116BASE)
•
Package
78-ball FBGA (EDJ1104/1108BASE)
96-ball FBGA (EDJ1116BASE)
Lead-free (RoHS compliant)
•
Power supply: VDD, VDDQ
=
1.5V
±
0.075V
•
Data rate
1600Mbps/1333Mbps/1066Mbps/800Mbps (max.)
•
1KB page size (EDJ1104/1108BASE)
Row address: A0 to A13
Column address: A0 to A9, A11 (EDJ1104BASE)
A0 to A9 (EDJ1108BASE)
•
2KB page size (EDJ1116BASE)
Row address: A0 to A12
Column address: A0 to A9
•
Eight internal banks for concurrent operation
•
Interface: SSTL_15
•
Burst lengths (BL): 8 and 4 with Burst Chop (BC)
•
Burst type (BT):
Sequential (8, 4 with BC)
Interleave (8, 4 with BC)
•
/CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11
•
/CAS Write Latency (CWL): 5, 6, 7, 8
•
Precharge: auto precharge option for each burst
access
•
Driver strength: RZQ/7, RZQ/6 (RZQ = 240Ω)
•
Refresh: auto-refresh, self-refresh
Features
•
Double-data-rate architecture; two data transfers per
clock cycle
•
The high-speed data transfer is realized by the 8 bits
prefetch pipelined architecture
•
Bi-directional differential data strobe (DQS and /DQS)
is transmitted/received with data for capturing data at
the receiver
•
DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
•
Differential clock inputs (CK and /CK)
•
DLL aligns DQ and DQS transitions with CK
transitions
•
Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
•
Data mask (DM) for write data
•
Posted /CAS by programmable additive latency for
better command and data bus efficiency
•
On-Die Termination (ODT) for better signal quality
Synchronous ODT
Dynamic ODT
Asynchronous ODT
•
Multi Purpose Register (MPR) for temperature read
out
•
ZQ calibration for DQ drive and ODT
•
Programmable Partial Array Self-Refresh (PASR)
•
/RESET pin for Power-up sequence and reset
function
•
SRT range:
Normal/extended
Auto/manual self-refresh
•
Programmable Output driver impedance control
•
Refresh cycles
Average refresh period
7.8µs at 0°C
≤
TC
≤ +85°C
3.9µs at
+85°C <
TC
≤ +95°C
•
Operating case temperature range
TC = 0°C to +95°C
Document No. E1128E60 (Ver. 6.0)
Date Published April 2009 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida
Memory, Inc. 2007-2009