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MPZ2012S331AT 参数 Datasheet PDF下载

MPZ2012S331AT图片预览
型号: MPZ2012S331AT
PDF下载: 下载PDF文件 查看货源
内容描述: 片式磁珠( SMD )为电源线 [Chip Beads(SMD) For Power Line]
分类和应用: PC
文件页数/大小: 2 页 / 65 K
品牌: EMC [ ELAN MICROELECTRONICS CORP ]
 浏览型号MPZ2012S331AT的Datasheet PDF文件第2页  
(1/2)
Chip Beads(SMD)
For Power Line
MPZ Series MPZ2012 Type
FEATURES
• The MPZ series are multilayer chip impeders for power supply
line applications.
• High miniaturized, these parts nonetheless exhibit low DC
resistance and high current handling capability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Noise elimination of DC power supply lines for USB interface
circuitry, personal computers, electronic games, hard disk drives,
and other general electronic equipment.
Also effective as a noise countermeasure in signal lines.
PRODUCT IDENTIFICATION
MPZ 2012 S 331 A T
(1)
(2) (3) (4) (5) (6)
(1)Series name
(2)Dimensions L× W
(3)Material code
(4)Nominal impedance
331: 330Ω at 100MHz
(5)Characteristic type
(6)Packaging style
T: Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
2+0.3, –0.1
1.25±0.2
0.5±0.3
0.85±0.2
1.3
1
1.3
1.2
Weight: 8mg
Dimensions in mm
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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