EN25B10
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial
Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is driven
Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first, on
Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction code.
Depending on the instruction, this might be followed by address bytes, or by data bytes, or by both or
none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has been shifted
in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read), Read
Status Register (RDSR) or Release from Deep Power-down, and Read Device ID (RDI) instruction, the
shifted-in instruction sequence is followed by a data-out sequence. Chip Select (CS#) can be driven High
after any bit of the data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Bulk Erase (BE), Write Status Register (WRSR),
Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP) instruction, Chip Select (CS#)
must be driven High exactly at a byte boundary, otherwise the instruction is rejected, and is not executed.
That is, Chip Select (CS#) must driven High when the number of clock pulses after Chip Select (CS#)
being driven Low is an exact multiple of eight.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.
Table 4. Instruction Set
Instruction Name
Write Enable
Write Disable
Read Status
Register
Write Status
Register
Read Data
Fast Read
Page Program
Sector Erase
Bulk Erase
Deep Power-down
Release from Deep
Power-down, and
read Device ID
Release from Deep
Power-down
Manufacturer/
Device ID
Read Identification
Byte 1
Code
06h
04h
05h
01h
03h
0Bh
02h
D8h
C7h
B9h
(4)
dummy
dummy
dummy
(ID7-ID0)
(S7-S0)(1)
S7-S0
A23-A16
A23-A16
A23-A16
A23-A16
A15-A8
A15-A8
A15-A8
A15-A8
A7-A0
A7-A0
A7-A0
A7-A0
(D7-D0)
dummy
D7-D0
(Next byte)
(D7-D0)
(Next byte)
continuous
(Next Byte)
continuous
continuous
continuous
(2)
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
ABh
90h
9Fh
dummy
(M7-M0)
dummy
(ID15-ID8)
00h(5)
(ID7-ID0)
(M7-M0)
(ID7-ID0)
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being read from
the device on the DO pin.
2. The Status Register contents will repeat continuously until CS# terminate the instruction.
3. All sectors may use any address within the sector.
4. The Device ID will repeat continuously until CS# terminate the instruction.
5. The Manufacturer ID and Device ID bytes will repeat continuously until CS# terminate the instruction.
00h on Byte 4 starts with MID and alternate with DID, 01h on Byte 4 starts with DID and alternate with MID.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
8
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
Rev. B, Issue Date: 2006/12/26
EON [ EON SILICON SOLUTION INC. ]
