epc100
CSP6 Tape
Pin 1
QFN16 Tape
Pin 1
8
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (T
L
) should not exceed +260°C for a maximum of 4 sec.
Packaging Information
(all measures in mm)
12
Pin 1
QFN16 Tape
Pin 1
8
8
Tape & Reel Information
The devices are mounted on embossed tape for
2
automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)
reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the
tape sizes for various package types. Further tape-and-reel specifications can be found in the
8
Electronic Industries Association (EIA) standard
481-1, 481-2, 481-3.
CSP6 Tape
4
epc does not guarantee that there are no empty cavities.
Thus, the pick-and-place machine should do check the presence of a chip during picking.
Ordering Information
Part Number
epc100-CSP10
epc100-QFN16
epc101-CSP10
epc101-QFN16
Package
CSP10
QFN16
CSP10
QFN16
RoHS compliance
Yes
Yes
Yes
Yes
Packaging Method
Reel
Reel
Reel
Reel
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
8
12
Datasheet epc100 - V2.1
www.espros.ch
EPC [ ESPROS PHOTONICS CORP ]
