epc130/epc131
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (T
L
) should not exceed +260°C for a maximum of 4 sec.
Packaging Information
(all measures in mm)
Tape & Reel Information
The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)
reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the
tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard
481-1, 481-2, 481-3.
CSP6 Tape
QFN16 Tape
Pin 1
Pin 1
8
2
8
epc does not guarantee that there are no empty cavities.
CSP6 Tape
pick-and-place machine should do check the
Tape
Thus, the
QFN16
presence of a chip during picking.
Pin 1
Pin 1
Order Information
Part Number
epc130-CSP6
epc130-QFN16
epc131-CSP6
epc131-QFN16
Package
4
8
RoHS compliance
Yes
Yes
Yes
Yes
8
Packaging Method
Reel
Reel
Reel
Reel
CSP6
QFN16
CSP6
QFN16
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
8
Datasheet epc13x analog - V2.1
www.espros.ch
12
12
EPC [ ESPROS PHOTONICS CORP ]
