Microwave Ceramics and Modules
2 – Pole Filter for W - LAN
Data Sheet
Processing information
Wettability to IEC 68-2-58:
≥
75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
Recommended soldering conditions (infrared):
Temp. [°C]
within 10 sec.
Filter
B69812N2457D201
Profile for leadfree
solder paste
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Temp. [°C]
within 10 sec.
215°C±10°C
245°C±5°C
20-40 sec.
40-80 sec.
Time [sec.]
30 sec.
2.5 °C/s
2-3 min.
Time [sec.]
> - 5 °C/s
Delivery mode
•
Blister tape acc. to IEC 286-3, grey
•
Pieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
26.04.04
ISSUE
A
PUBLISHER
SAW MWC PD
PAGE
4/4
EPCOS [ EPCOS ]
