Jumbo-LED
07.05.2008
ELJ-830-649-1
rev. 02
Handling precautions
To prevent damage to the LED during soldering and assembly, following precautions have to be
taken into account.
a) The bending point of the lead frame
should be located at least 2.5 mm away
from the body.
b) While bending, the base of the lead
frame has to be fixed with radio pliers or
similar.
c) To ensure an adequate strain relief, the
lead frames have to be firmly fixed during
soldering.
d) To avoid any damage of the LED
during soldering the lead frames should
not be distorted especially when they
have been heated
e) LEDs are static sensitive devices, so
adequate handling precautions have to be
taken, e.g. wearing grounding wrist straps.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
5 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
EPIGAP [ EPIGAP OPTOELECTRONIC GMBH ]
