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M52D32321A-7BG 参数 Datasheet PDF下载

M52D32321A-7BG图片预览
型号: M52D32321A-7BG
PDF下载: 下载PDF文件 查看货源
内容描述: 512K X 32位X 2Banks手机同步DRAM [512K x 32Bit x 2Banks Mobile Synchronous DRAM]
分类和应用: 存储内存集成电路动态存储器手机
文件页数/大小: 30 页 / 834 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT
SIMPLIFIED TRUTH TABLE
COMMAND
CKEn-1 CKEn CS
Mode Register Set
H
X
L
Register
Extended Mode Register
H
X
L
Set
Auto Refresh
H
H
L
Entry
L
Refresh
Self Refresh
L
Exit
L
H
H
Bank Active & Row Addr.
H
X
L
Auto Precharge Disable
Read &
H
X
L
Column Address
Write & Column
Address
Burst Stop
Precharge
Clock Suspend or
Active Power Down
Precharge Power Down Mode
DQM
No Operation Command
Deep Power Down Mode
Entry
Exit
Bank Selection
Both Banks
Entry
Exit
Entry
Exit
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
H
H
H
H
L
H
L
H
H
H
H
L
X
X
X
L
H
L
H
X
L
H
L
L
L
H
L
X
H
L
H
L
H
L
L
X
RAS
L
L
L
H
X
L
H
H
H
L
X
V
X
X
H
X
V
X
X
H
H
X
CAS
L
L
L
H
X
H
L
L
H
H
X
V
X
X
H
X
V
X
H
H
X
WE
L
M52D32321A
DQM BA A10/AP A9~A0 Note
X
OP CODE
1,2
X
X
X
X
X
X
X
X
X
X
X
X
V
X
X
X
X
X
X
X
7
V
X
L
H
X
V
V
V
OP CODE
X
X
Row Address
Column
L
H
L
H
X
X
1,2
3
3
3
3
4
Address
(A0~A7)
4,5
Column
4
Address
4,5
(A0~A7)
L
H
H
X
H
H
L
L
L
X
V
X
X
H
X
V
X
H
L
X
6
4
4
(V= Valid, X= Don’t Care, H= Logic High , L = Logic Low)
Note:
1. OP Code: Operation Code
A0~A10/AP, BA: Program keys.(@MRS). BA=0 for MRS and BA=1 for EMRS.
2. MRS/EMRS can be issued only at both banks precharge state.
A new command can be issued after 2 clock cycle of MRS/EMRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by “Auto”.
Auto / self refresh can be issued only at both banks precharge state.
4. BA: Bank select address.
If “Low”: at read, write, row active and precharge, bank A is selected.
If “High”: at read, write, row active and precharge, bank B is selected.
If A10/AP is “High” at row precharge, BA ignored and both banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read /write command can be issued after the end of burst.
New row active of the associated bank can be issued at t
RP
after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but
makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
Elite Semiconductor Memory Technology Inc.
Publication Date
:
May 2009
Revision
:
1.6
10/30