ESMT
AC OPERATING TEST CONDITIONS
(V
DD
=2.5V
±
0.2V,T
A
= 0 °C ~ 70 °C )
Parameter
Input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Value
0.9 x V
DDQ
/ 0.2
0.5 x V
DDQ
tr / tf = 1 / 1
0.5 x V
DDQ
See Fig.2
M52S32321A
Operation Temperature Condition -40
℃
~85
℃
Unit
V
V
ns
V
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Row active to row active delay
RAS to CAS delay
Row precharge time
Row active time
Symbol
-6
t
RRD
(min)
t
RCD
(min)
t
RP
(min)
t
RAS
(min)
t
RAS
(max)
Row cycle time
Last data in to new col. Address delay
Last data in to row precharge
Last data in to burst stop
Col. Address to col. Address delay
Number of valid output data
t
RC
(min)
t
CDL
(min)
t
RDL
(min)
t
BDL
(min)
t
CCD
(min)
CAS latency=3
CAS latency=2
54
12
18
18
36
Version
-7.5
15
22.5
22.5
45
100
67.5
1
2
1
1
2
1
90
-10
20
30
30
50
ns
ns
ns
ns
us
ns
CLK
CLK
CLK
CLK
ea
1
2
2
2
3
4
1
1
1
1
Unit
Note
Note:
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and
then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
The earliest a precharge command can be issued after a Read command without the loss of data is CL+BL-2 clocks.
Elite Semiconductor Memory Technology Inc.
Publication Date
:
Nov. 2008
Revision
:
1.0
5/29
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
