APPLICATIONS
POWER SEMICONDUCTORS
Mario Feldvoss
q
Andreas Karl
IGBT modules of the second generation:
Econopacks shrink frequency
converters
Siemens has developed
technically superior, but
low-cost packages for
second-generation IGBTs
in the power range from
0.75 to 75 kW. The new
Econopacks reduce space
requirements by two-thirds
and weight by three-
quarters.
modules is reduced by a factor of three,
their weight by as much as a factor of
four. A three-phase full bridge for 100 A in
an Econopack 3 (type BSM100GD120DN2)
for example, weighs only 300 grams in
comparison with the 1260 grams of three
conventional half-bridge modules.
These modules are currently available as
three-phase full bridges (six-packs) for
reverse voltages of 600 and 1200 V and as
tripacks (Table
1).
Modules for 6 20 A to
6 50 A at 600 V, and for 6 x 10 A to 6 50 A
at 1200 V are available in Econopack 2
packages. The modules for the power range
6 75 to 6 100 A or 3 150 A to 3 200 A
at 1200 V are all housed in Econopack 3
packages.
Assembly times slashed
connected in parallel. In the Econopack 2,
for example, the 50 A six-pack of type
BSM50GD120DN2 can also be used as a
150 A half-bridge by shorting output pins U,
V and W.
The same applies to modules in the Econo-
pack 3. Thanks to its pin configuration, this
package also allows designers to connect
several full bridges in parallel (Fig.
2)
and
thus double the power. The collector current
does not have to be reduced because the
saturation voltage of the IGBT has a positive
temperature coefficient. The gate drop re-
sistor integrated into the IGBT chips ensures
uniform current distribution at turn-on when
the various IGBTs are driven.
The tripack solution in the Econopack 3 also
offers the option of connecting its three
A
s well as capacitors and heat sinks,
insulated gate bipolar transistors
(IGBTs) for power control have a
major impact on cost in the design of
frequency converters. In conventional
IGBTs configured as half-bridges or single
switches, the package accounts for a con-
siderable share of component costs. IGBT
technology of the second generation allows
more switching elements to be squeezed
into a package without power dissipation
leading to significantly higher chip tempera-
tures. The Econopack 2 and Econopack 3
packages of technically superior design
(Fig.
1)
can withstand higher temperature
and load variations than conventional mod-
ules. What’s more, they cost less and take
up less space.
Compact, lightweight packages
Thanks to the compact design of Econo-
packs, the space requirement of IGBT
The Econopack packages have solderable
pins, so assembly time can be reduced by a
factor of eight in comparison with conven-
tional screw and plug-in contacts, e.g. from
320 to 40 seconds for a 50 A full-bridge
circuit. The drive pins and power terminals
are located on opposite sides of the pack-
age. The concept of solderability throughout
and the separate pin arrangement in
conjunction with a wide range of var-
iants reduce layout costs consider-
ably. The clearances and leakage
paths between the pins are such that
modules soldered onto the circuit board
comply with relevant safety requirements
such as UL 840, UL 508C, IEV 335,
VDE 0110 and VDE 160.
Custom configurability
Beyond this, the switches contained in the
module can be individually configured or
Fig. 1 Second-generation IGBTs in
Econopack 2 (top) and Econopack 3 (bottom)
packages reduce the space requirements and
weight of frequency converters
6
Components XXXI (1996) No. 3
EUPEC [ EUPEC GMBH ]
