XRP6657
1.5A 1.3MHz Synchronous Step Down Converter
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Input Voltage Range VIN...............................2.5V to 5.5V
Ambient Temperature Range TA ................. -40°C to 85°C
Thermal Resistance θJC ...................................... 10ºC/W
Thermal Resistance θJA ...................................... 55ºC/W
Note 1: TJ is a function of the ambient temperature TA and
power dissipation PD (TJ= TA + PD x 55°C/W).
Input Voltage VIN .......................................-0.3V to 6.0V
EN, VFB Voltage ........................................... -0.3V to VIN
SW Voltage...................................... -0.3V to (VIN+0.3V)
PMOS Switch Source Current (DC).............................. 2A
NMOS Switch Sink Current (DC)................................. 2A
Peak Switch Sink and Source Current....................... 3.5A
Junction Temperature TJ1,2 ....................................125ºC
Lead Temperature (Soldering, 10 sec) ...................260°C
Storage Temp. Range TSTG .......................-65ºC to 150ºC
ESD Rating (HBM - Human Body Model).................... 2kV
ESD Rating (MM - Machine Model) ...........................200V
Note 2:XRP6657 has a build-in temperature protection
circuitry to avoid damages from overload conditions.
ELECTRICAL SPECIFICATIONS
Specifications with standard type are for an Operating Junction Temperature of TA = 25°C only; limits applying over the full
Operating Ambient Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TA = 25°C, and are provided
for reference purposes only. Unless otherwise indicated, VIN = 5.0V, TA= 25°C.
Parameter
Min.
Typ.
Max.
Units
Conditions
Feedback Current IVFB
±100
0.612
0.615
nA
0.600
0.600
TA = 25°C
0.588
0.585
Regulated Feedback Voltage VFB
V
•
•
•
-40°C ≤ TA ≤ 85°C
Reference Voltage Line
Regulation ΔVFB
0.4
3
%/V
%
Output Voltage Accuracy ΔVOUT
%
-3
Output Over-Voltage Lockout
ΔVOVL
50
80
mV
ΔVOVL = VOVL - VFB
20
Output Voltage Line Regulation
ΔVOUT
•
0.4
%/V
A
VIN = 2.5V to 5.5V
Peak Inductor Current IPK
VIN=3V, VFB=0.5V or VOUT=90%,
duty cycle<35%
2.4
0.2
Output Voltage Load Regulation
VLOADREG
%/V
IOUT=10mA to 1.5A
2
Quiescent Current IQ
240
0.1
340
1
µA
µA
MHz
%
VFB=0.5V or VOUT=90%
VEN=0V, VIN=4.2V
Shutdown Current ISHTDWN
Oscillator Frequency fOSC
Minimum Duty Cycle DMIN
RDS(ON) of PMOS RPFET
RDS(ON) of NMOS RNFET
SW Leakage ILSW
•
1.3
1.56
VFB=0.6V or VOUT=100%
1.04
0.4
20
0.18
0.16
Ω
ISW=750mA
Ω
ISW=-750mA
±1
µA
V
VEN=0V, VSW=0V or 5V, VIN=5V
•
•
•
Enable Threshold VEN
1.2
Shutdown Threshold VEN
EN Leakage Current IEN
V
±1
µA
Note 1: The Switch Current Limit is related to the Duty Cycle. Please refer to figure 29 for details.
Note 2: Dynamic quiescent current is higher due to the gate charge being delivered at the switching frequency.
© 2009 Exar Corporation
2/11
Rev. 1.0.0
EXAR [ EXAR CORPORATION ]
