EIC1012-12
10.95-12.75 GHz 12-Watt Internally Matched Power FET
FEATURES
•
•
•
•
•
•
•
10.95 – 12.75 GHz Bandwidth
Input/Output Impedance Matched to 50 Ohms
+41.5 dBm Output Power at 1dB Compression
6 dB Power Gain at 1dB Compression
28% Power Added Efficiency
Hermetic Metal Flange Package
100% Tested for DC, RF, and R
TH
.827±.010 .669
.120 MIN
Excelics
EIC1012-12
.024
.421
YYWW
SN
.120 MIN
.125
.508±.008
.442
.168±.010
.004
.004
.063
.105±.008
ALL DIMENSIONS IN INCHES
ELECTRICAL CHARACTERISTICS (T
a
= 25°C)
Caution! ESD sensitive device.
SYMBOL
P
1dB
G
1dB
∆G
PAE
Id
1dB
I
DSS
V
P
R
TH
PARAMETERS/TEST CONDITIONS
1
Output Power at 1dB Compression
f = 10.95-12.75 GHz
V
DS
= 10 V, I
DSQ
≈
3200mA
Gain at 1dB Compression
f = 10.95-12.75 GHz
V
DS
= 10 V, I
DSQ
≈
3200mA
Gain Flatness
f = 10.95-12.75 GHz
V
DS
= 10 V, I
DSQ
≈3200mA
Power Added Efficiency at 1dB Compression
V
DS
= 10 V, I
DSQ
≈
3200mA
f =10.95-12.75 GHz
Drain Current at 1dB Compression
Saturated Drain Current
Pinch-off Voltage
Thermal Resistance
2
f =10.95-12.75 GHz
V
DS
= 3 V, V
GS
= 0 V
V
DS
= 3 V, I
DS
= 75 mA
MIN
41
5
TYP
41.5
6
MAX
UNITS
dBm
dB
±0.75
28
3700
8
-2.5
1.8
4100
10
-4.0
2.1
o
dB
%
mA
A
V
C/W
Note: 1) Tested with 30 Ohm gate resistor. Forward and reverse gate current should not exceed 130mA and -10.5mA respectively
2) Overall Rth depends on case mounting.
MAXIMUM RATING AT 25°C
1,2
SYMBOLS
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Input Power
Channel Temperature
Storage Temperature
Total Power Dissipation
ABSOLUTE
1
15
-5
37.5dBm
175
o
C
-65 to +175
o
C
71.5W
OPERATING
2
10V
-4V
@ 3dB Compression
175
o
C
-65 to +175
o
C
71.5W
Vds
Vgs
Pin
Tch
Tstg
Pt
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web:
www.excelics.com
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