EMP114-Q5
UPDATED: 04/24/2008
7.0 – 9.0 GHz Surface-Mounted PA
CHIP OUTLINE AND PIN ASSIGNMENT
Top View
0.197±0.002
0.197±0.002
Bottom View
16
20
EMP114
-Q5
0 REF
0.197±0.002
0.049 MAX
0.008
0 REF
0 REF
0.164
15
1
0.042
0.034
0.016
0 REF
11
5
10
6
0.026±0.002
0.012±0.002
Additional Notes:
1) Ground Plane must be soldered to PCB RF ground
2) All dimensions are in inches
3) Refer to Excelics application notes on QFNs for further guidelines
4) Pin Assignment:
Top View
Vd1
Vd2
Bottom View
Vd2
16
Vd1
20
RFin
EMP114
-Q5
Vg
15
1
RFout
RFout
RFin
11
5
10
6
Vg
Pin
1, 2, 4, 5
3
6
7, 8, 9, 10, 11, 12, 14, 15
13
16
17, 18, 19
20
Assignment
NC
RF
in
V
g
NC
RF
out
V
d2
NC
V
d1
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web:
www.excelics.com
Page 2 of 3
May 2008
EXCELICS [ EXCELICS SEMICONDUCTOR, INC. ]
