74LCX245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs
February 1994
Revised March 2005
74LCX245
Low Voltage Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCX245 contains eight non-inverting bidirectional buff-
ers with 3-STATE outputs and is intended for bus oriented
applications. The device is designed for low voltage (2.5V
and 3.3V) V
CC
applications with capability of interfacing to
a 5V signal environment. The T/R input determines the
direction of data flow through the device. The OE input dis-
ables both the A and B ports by placing them in a high
impedance state.
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V to 3.6V V
CC
specifications provided
s
7.0 ns t
PD
max (V
CC
3.3V), 10
P
A I
CC
max
s
Power down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
r
24 mA output drive (V
CC
3.0V)
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
200V
s
Leadless DQFN Pb-Free package
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX245WM
(Note 2)
74LCX245WMX_NL
(Note 4)
74LCX245SJ
(Note 2)
74LCX245BQX
(Note 3)
74LCX245MSA
(Note 2)
74LCX245MTC
(Note 2)
74LCX245MTCX_NL
(Note 4)
Package
Number
M20B
M20B
M20D
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
MSA20
MTC20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Pb-Free package per JEDEC J-STD-020B.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 3:
DQFN package available in Tape and Reel only.
Note 4:
“_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012006
www.fairchildsemi.com
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
