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FDC634P 参数 Datasheet PDF下载

FDC634P图片预览
型号: FDC634P
PDF下载: 下载PDF文件 查看货源
内容描述: P沟道2.5V指定的PowerTrench MOSFET [P-Channel 2.5V Specified PowerTrench MOSFET]
分类和应用: 晶体小信号场效应晶体管开关光电二极管PC
文件页数/大小: 5 页 / 138 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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FDC634P
Electrical Characteristics
Symbol
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSSF
I
GSSR
T
A
= 25°C unless otherwise noted
Parameter
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
(Note 2)
Test Conditions
V
GS
= 0 V, I
D
= –250
µA
I
D
= –250
µA,
Referenced to 25°C
V
DS
= –16 V, V
GS
= 0 V
V
GS
= 8 V,
V
GS
= –8 V
V
DS
= 0 V
V
DS
= 0 V
Min
–20
Typ
Max Units
V
Off Characteristics
–12
–1
100
–100
mV/°C
µA
nA
nA
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
V
DS
= V
GS
, I
D
= –250
µA
I
D
= –250
µA,
Referenced to 25°C
V
GS
V
GS
V
GS
V
GS
= –4.5 V, I
D
= –3.5 A
= –2.5 V, I
D
= –3.1 A
= –4.5 V, I
D
= –3.5A,T
J
=125°C
= –4.5 V, V
DS
= –5 V
I
D
= –3.5 A
–0.4
–0.8
3
60
82
77
–1.5
V
mV/°C
80
110
130
mΩ
I
D(on)
g
FS
–10
11
A
S
V
DS
= –5 V,
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(Note 2)
V
DS
= –10 V,
f = 1.0 MHz
V
GS
= 0 V,
779
121
56
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
I
S
V
SD
Notes:
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V
DD
= –10 V,
V
GS
= –4.5 V,
I
D
= –1 A,
R
GEN
= 6
10
9
27
11
20
19
43
20
10
ns
ns
ns
ns
nC
nC
nC
V
DS
= –10 V,
V
GS
= –4.5 V
I
D
= –3.5 A,
7.2
1.7
1.5
Drain–Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= –1.3 A
(Note 2)
–1.3
–0.8
–1.2
A
V
1.
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a)
78°C/W when
mounted on a 1in
2
pad
of 2 oz copper
b)
156°C/W when mounted
on a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDC634P Rev E(W)