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MM74HC4050 参数 Datasheet PDF下载

MM74HC4050图片预览
型号: MM74HC4050
PDF下载: 下载PDF文件 查看货源
内容描述: 六角反相逻辑电平下变频器。十六进制逻辑电平下变频器 [Hex Inverting Logic Level Down Converter . Hex Logic Level Down Converter]
分类和应用:
文件页数/大小: 6 页 / 72 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter
February 1984
Revised October 1999
MM74HC4049 • MM74HC4050
Hex Inverting Logic Level Down Converter •
Hex Logic Level Down Converter
General Description
The MM74HC4049 and the MM74HC4050 utilize
advanced silicon-gate CMOS technology, and have a mod-
ified input protection structure that enables these parts to
be used as logic level translators which will convert high
level logic to a low level logic while operating from the low
logic supply. For example, 0–15V CMOS logic can be con-
verted to 0–5V logic when using a 5V supply. The modified
input protection has no diode connected to V
CC
, thus allow-
ing the input voltage to exceed the supply. The lower zener
diode protects the input from both positive and negative
static voltages. In addition each part can be used as a sim-
ple buffer or inverter without level translation. The
MM74HC4049 is pin and functionally compatible to the
CD4049BC and the MM74HC4050 is compatible to the
CD4050BC
Features
s
Typical propagation delay: 8 ns
s
Wide power supply range: 2V–6V
s
Low quiescent supply current: 20
µA
maximum (74HC)
s
Fanout of 10 LS-TTL loads
Ordering Code:
Order Number
MM74HC4049M
MM74HC4049SJ
MM74HC4049MTC
MM74HC4049N
MM74HC4050M
MM74HC4050SJ
MM74HC4050MTC
MM74HC4050N
Package Number Package Description
M16A
M16D
MTC16
N16E
M16A
M16D
MTC16
N16E
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
MM74HC4049
MM74HC4050
© 1999 Fairchild Semiconductor Corporation
DS005214
www.fairchildsemi.com