Ferroxcube
IIC10-14/4
IIC10P-14/4 IIC10G-14/4
Integrated inductive components
GENERAL DATA
Isolation resistance
>100 MΩ between leads.
ITEM
SPECIFICATION
Leadframe
material
copper (Cu), tin-lead (SnPb) plated,
lead-free (Sn) available on request.
Inter winding capacitance
2 windings of 5 turns:
unifilar ≈5 pF
Moulding
material
liquid crystal polymer (LCP), flame
retardant in accordance with “ULV94-0”
Solderability “IEC 60068-2-58”, Par t 2, Test Ta,
method 1
bifilar ≈10 pF.
(depending on track layout; see Figs 2 and 3)
Taping
“IEC 60286-3” and “EIA 481-1”
method
Leakage inductance
2 windings of 5 turns:
unifilar ≈1.8 µH
Rdc
≈65 mΩ (25 °C) and ≈85 mΩ (100 °C) for 10 turns
including 20 solder joints (assuming 70 µm Cu PCB
tracks).
bifilar ≈0.2 µH.
Maximum continuous current (DC)
Isolation voltage
4 A (depending on copper track thickness on PCB).
>500 V (DC) between leads and between leads and ferrite
core.
Maximum peak current
10 A.
ndbook, 4 columns
ndbook, 4 columns
Remove for use
as 5+5 turns
CBW540
CBW541
Fig.4 Unifilar track pattern.
Fig.5 Bifilar track pattern.
2004 Sep 01
5