Advanced Product Information
1.1
FMS2020
Truth Table:
V1
High
Low
V2
Low
High
PATH (ON)
RF1-ANT
RF2-ANT
Note:
‘High’
‘Low’
= +2.5V to +5V
= 0V to 0.2V
Pad and Die Layout:
B
D
Pad
A
Pad
Name
ANT
RF1
RF2
V1
V2
GND T1
GND T2
Description
Antenna
RF1 Output
RF2 Output
RF1 Control Voltage
RF2 Control Voltage
Ground 1
Ground 2
Pin Coordinates
(µm)
732, 510
270, 920
280, 101
731, 918
734, 98
186, 885
186, 420
F
A
G
B
C
D
E
F
G
C
E
Note:
Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
930 x 1020(engineering mask)
Die Thickness (µm)
100
Min. Bond Pad
Pitch(µm)
166
Min. Bond pad
opening (µm)
70 x 70
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790
Fax: +1 (408) 850 5766
Email:
sales@filcsi.com
Website: www.filcs.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
