Advanced Product Information
1.1
FMS2021
Truth Table:
State
1
2
3
4
5
6
Vctrl1
HIGH
LOW
LOW
LOW
LOW
HIGH
Vctrl2
LOW
HIGH
LOW
LOW
HIGH
LOW
Vctrl3
LOW
LOW
HIGH
LOW
LOW
HIGH
Vctrl4
LOW
LOW
LOW
HIGH
HIGH
LOW
ON PATH(S)
ANT1-RX
ANT2-RX
ANT2-TX
ANT1-TX
ANT1-TX and ANT2-RX
ANT1-RX and ANT2-TX
Note:
‘High’
‘Low’
= +2.4V to +3.3V
= 0V to +0.2V
Pad and Die Layout:
Pad
Name
V4
Description
Vctrl4
Antenna 1
Antenna 2
Vcrtl1
Ground 2
Vctrl3
Receive
Transmit
Vctrl2
Ground 1
Pin Coordinates
(x
µm,
y
µm)
134 , 568
134 , 439
134 , 257
134 , 114
355.5 , 114
547 , 114
547 , 257
547 , 439
547 , 568
353 , 568
V4
GND1
ANT1
V2
ANT1
TX
ANT2
V1
GND2
ANT2
GND2
V1
RX
V3
RX
TX
V3
V2
GND1
Note:
Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
(µm x µm)
660 x 680
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
129
Min. Bond pad
opening (µm x µm)
80 x 80
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790
Fax: +1 (408) 850 5766
Email:
sales@filcsi.com
Website: www.filcs.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
