FMS2029
Pre-Production Datasheet v3.0
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of conductive epoxy. Epoxy should be applied
to the attachment surface uniformly and
sparingly to avoid encroachment of epoxy on
to the top face of the die and ideally should not
exceed half the chip height. For automated
dispense Ablestick LMISR4 is recommended
and for manual dispense Ablestick 84-1 LMI or
84-1 LMIT are recommended. These should be
cured at a temperature of 150°C for one hour
in an oven especially set aside for epoxy
curing only. If possible the curing oven should
be flushed with dry nitrogen. Eutectic die
attach is not recommended.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4µm diameter gold wire
be used. Thermosonic ball bonding is
preferred. A nominal stage temperature of
150°C and a bonding force of 40g has been
shown to give effective results for 25µm wire.
Ultrasonic energy shall be kept to a minimum.
For this bonding technique, stage temperature
should not be raised above 200°C and bond
force should not be raised above 60g.
Thermosonic
wedge
bonding
and
thermocompression wedge bonding can also
be used to achieve good wire bonds.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
H
ANDLING
P
RECAUTIONS
:
To avoid damage to
the
devices
care
should be exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages
of storage, handling, assembly, and testing.
These devices should be treated as Class 1A
(250-500 V) as defined in JEDEC Standard
No. 22-A114. Further information on ESD
control measures can be found in MIL-STD-
1686 and MIL-HDBK-263.
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters are available on request.
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RDERING
I
NFORMATION
:
P
ART
N
UMBER
FMS2029-000-WP
D
ESCRIPTION
Die in Waffle-pack
(Gel-pak available on
request)
5
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website:
www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
