FPM2750QFN
Datasheet v2.5
P
ACKAGE
O
UTLINE
:
(dimensions in millimeters – mm, centre paddle and pin 1 identifier are grounded)
T
ERMINAL
1-4, 6, 15
5
7, 9-12, 14
8
13
16
F
UNCTION
Source 1
RFin 1
Source 2
RFin 2
RFout 2
RFout 1
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
Please
contact
Filtronic
Compound
Semiconductors Ltd for further details.
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters are available; please contact
Filtronic Compound Semiconductors Ltd.
H
ANDLING
P
RECAUTIONS
:
To avoid damage to
the
devices
care
should be exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages of
storage, handling, assembly, and testing.
These devices should be treated as Class 0 (0-
250 V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RDERING
I
NFORMATION
:
P
ART
N
UMBER
FPM2750QFN
EB-FPM2750QFN-BAL
D
ESCRIPTION
Packaged pHEMT
Balanced Packaged pHEMT
evaluation board
EB-FPM2750QFN-SE
Single-ended Packaged pHEMT
evaluation board
8
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website:
www.filtronic.com