F72815
9
GND
Power ground pin for the chip
5. Electrical Characteristic
Absolute Maximum Ratings
PARAMETER
IC supply voltage
PHASE to GND
BOOT to PHASE
BOOT to GND
PWM controller outputs
PWM controller outputs
Feedback voltages
ESD classification
※
Maximum junction temperature (plastic package)
※
Maximum storage temperature
※
Maximum lead temperature (soldering 10s)
SYMBOL
VCC
VPHASE – GND
VBOOT - VPHASE
VBOOT - GND
UGATE
LGATE
FB
HBM
T
j
T
STO
RATINGS
15
15
15
VCC + 15
(VPHASE - 0.3) to (VBOOT + 0.3)
(GND - 0.3) to (VCC + 0.3)
(GND - 0.3) ~ 7
2
150
-65 ~ 150
260
UNIT
V
V
V
V
V
V
V
kV
°C
°C
°C
Note:
If ICs are stressed beyond the limits listed in the “absolute maximum ratings”, they may be permanently destroyed. These are stress
ratings only and functional operations of the device at these or any other condition beyond those indicated under “recommended operating
conditions” are not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
PARAMETER
Supply Voltage
Ambient Temperature
Junction Temperature
SYMBOL
VCC
RATINGS
5
±
5%,12
±
10%
0 ~ 70
0 ~ 125
UNIT
V
°C
°C
Package thermal information
PARAMETER
Thermal resistance junction-ambient
SYMBOL
Rth_ja
SOIC
133(R), 160(O)
UNIT
°C/W
DC and AC electrical characteristics
(VCC = 12V, TA = 25
℃
)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC SUPPLY CURRENT/Regulated Voltage
Nominal supply current 5VCC
I
CC
UGATE, LGATE and DRIVE2 open
6
15
mA
F72815
-3-
Aug, 2007
V0.14
FINTEK [ FEATURE INTEGRATION TECHNOLOGY INC. ]
