MELF Schottky Barrier Diodes
SM5817 THRU SM5819
Silicon epitaxial planer type
Formosa MS
SM-1
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy M
olding Compound.
For surface mounted applications.
.205(5.2)
.190(4.8)
.024(.60)
.018(.46)
SOLDERABLE
ENDS
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
.105(2.7)
.095(2.4)
Mechanical data
Case : Molded plastic, SM-1 (MELF)
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting P
osition : Any
Weight : 0.015 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
Forward rectified current
Forward surge current
See Fig.2
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
A
=
25
o
C
o
CONDITIONS
Symbol
I
O
I
FSM
MIN.
TYP.
MAX.
1.0
25
1.0
10
UNIT
A
A
mA
mA
o
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
I
R
Rq
JA
C
J
T
STG
-55
80
110
V
R
= V
RRM
T
A
= 100 C
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
C / w
pF
+150
o
C
SYMBOLS
MARKING
CODE
-
-
-
V
RRM
(V)
*1
V
RMS
(V)
14
21
28
*2
V
R
*3
V
F
*4
Operating
temperature
(
o
C)
*1 Repetitive peak reverse voltage
*2 RMS voltage
(V)
20
30
40
(V)
0.45
0.55
0.60
SM5817
SM5818
SM5819
20
30
40
-55 to +125
*3 Continuous reverse voltage
*4 Maximum forward voltage
FORMOSA [ FORMOSA MS ]
