Freescale Semiconductor, Inc.
MC12019
OUTLINE DIMENSIONS
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
ISSUE T
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D
5
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4
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0.25
M
B
M
h
ARCHIVE INFORMATION
Freescale Semiconductor, Inc...
C
A
SEATING
PLANE
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
L
0.10
A1
B
0.25
M
C B
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MOTOROLA RF/IF DEVICE DATA
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MC12019/D
3
ARCHIVE INFORMATION
B
X 45
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NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
_
7
_
e
q
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
