Mechanical Specifications
24.3 52-Pin Low-Profile Quad Flat Pack (LQFP)
4X
4X 13 TIPS
0.20 (0.008) T L–M N
0.20 (0.008)
H
L–M
N
–X–
X=L, M, N
52
40
C
1
39
L
AB
AB
G
3X VIEW Y
–L–
–M–
B1
B
V
VIEW Y
F
BASE METAL
PLATING
V1
13
27
J
U
14
26
–N–
D
A1
S1
M
S
S
0.13 (0.005)
T
L–M
N
SECTION AB–AB
A
ROTATED 90° CLOCKWISE
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
4X
θ2
C
0.10 (0.004)
T
–H–
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
–T–
SEATING
PLANE
4X θ3
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
VIEW AA
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
S
0.05 (0.002)
MILLIMETERS
MIN MAX
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
W
2X R R1
DIM
A
A1
B
B1
C
C1
C2
D
θ1
0.25 (0.010)
C2
θ
–––
1.70
–––
0.067
0.008
0.059
0.016
0.030
0.014
GAGE PLANE
0.05
1.30
0.20
0.45
0.22
0.20
1.50
0.40
0.75
0.35
0.002
0.051
0.008
0.018
0.009
K
E
E
F
C1
G
J
K
R1
S
0.65 BSC
0.026 BSC
0.07
0.20
0.003
0.008
VIEW AA
Z
0.50 REF
0.020 REF
0.08
0.20
0.003
0.008
12.00 BSC
6.00 BSC
0.09 0.16
0.472 BSC
0.236 BSC
0.004 0.006
S1
U
V
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
V1
W
Z
θ
0°
7°
0°
7°
–––
REF
REF
–––
REF
REF
θ
θ
θ
1
2
3
0
12
12
°
°
°
0°
12°
12°
Figure 24-1. 52-Pin Low-Profile Quad Flat Pack (Case No. 848D)
Technical Data
408
MC68HC908LJ12 — Rev. 2.1
Freescale Semiconductor
Mechanical Specifications
FREESCALE [ Freescale ]
