PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
Part Number
MPX5010D
MPX5010DP
MPX5010GP
MPX5010GS
MPX5010GSX
MPXV5010G6U
MPXV5010G7U
MPXV5010GC6U/T1
MPXV5010GC7U
MPXV5010GP
MPXV5010DP
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
867
867C
867B
867E
867F
482
482B
482A
482C
1369
1351
Pressure (P1)
Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Stainless Steel Cap
Stainless Steel Cap
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPX5010
6
Sensors
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
