PACKAGE DIMENSIONS
C
R
M
B
-A-
N
PIN 1
SEATING
PLANE
1
2
3
4
5
6
POSITIVE PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
L
-T-
F
G
D
6 PL
0.136 (0.005)
M
J
S
T A
M
DIM
A
B
C
D
F
G
J
L
M
N
R
S
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
CASE 867-08
ISSUE N
UNIBODY PACKAGE
T
R
SEATING PLANE
A
U
L
V
Q
Q
B
1
2
3 4
5
6
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
MILLIMETERS
MAX
MIN
29.85
29.08
18.16
17.4
8.26
7.75
0.84
0.68
1.63
1.22
2.54 BSC
0.41
0.36
18.42
17.65
7.62
7.37
11.18
10.67
4.04
3.89
4.04
3.89
6.35
5.84
6.1
5.59
23.11 BSC
4.93
4.62
N
K
S
P
C
J
0.25
M
PIN 1
P
T Q
M
G
F
6X
D
0.173
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
V
OUT
GROUND
V
CC
V1
V2
V
EX
CASE 867B-04
ISSUE F
UNIBODY PACKAGE
MPX5100
8
Sensors
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
