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DS_UMFT311EV 参数 Datasheet PDF下载

DS_UMFT311EV图片预览
型号: DS_UMFT311EV
PDF下载: 下载PDF文件 查看货源
内容描述: 该FT311D开发模块是利用FT311D IC开发USB配件连接通过Android开放配件模式的Android平台的开发模块。 [The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.]
分类和应用:
文件页数/大小: 16 页 / 827 K
品牌: FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
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DS_UMFT311EV
USB ANDROID HOST MODULE Datasheet
Document No.: FT_000689 Clearance No.: FTDI# 303
Version 1.0
Future Technology Devices
International Ltd
.
DS_FT311D_Development_Module:
UMFT311EV
(USB Android Host Module)
The FT311D Development Module is a
development module which utilises the
FT311D IC to develop USB accessories
connecting to Android platforms via
Android Open Accessory mode. It is a Full
Speed USB host specifically targeted at
providing access to peripheral hardware
from an Android platform with a USB
device port. The FT311D IC will bridge the
USB port to any one of the six user
selectable interface types like GPIO, UART,
PWM, I2C Master, SPI Master, SPI Slave
and has the following advanced features:
Based on single chip USB Android Host FT311D IC.
Entire USB protocol handled on the chip.
Any one of the six user selectable interface types:-
GPIO, UART, PWM, I2C Master, SPI Master, SPI Slave
Interface options selectable via 3 mode select pins.
7 GPIO lines interface option
USB error indicator pin
Basic UART interface with RXD, TXD, RTS, CTS,
TX_ACTIVE pins option.
4 PWM channels option.
I
2
C Master interface option.
SPI Slave interface option supporting modes 0, 1, 2
and 3 with MSB/LSB options
SPI Master interface option supporting modes 0, 1, 2
and 3 with MSB/LSB options.
Suitable for use on any Android platform
supporting Android Open Accessory Mode
(Typically 3.1 onwards, however some
platforms may port Open Accessory Mode
to version 2.3.4)
12MHz external crystal.
Standard USB Host connector to connect
with Android USB Slave device.
+5V Single Supply Operation.
USB 2.0 Full Speed compatible.
Extended operating temperature range; -
40 to +85⁰C.
Board dimensions: 68.58mm x 55.38mm
x 14.00mm (L x W x H).
Reduce development time.
Rapid integration into existing systems.
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd,
Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41
1HH
United Kingdom. Scotland Registered Company Number: SC136640
Copyright © 2012 Future Technology Devices International Limited
1