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1MBH50-060 参数 Datasheet PDF下载

1MBH50-060图片预览
型号: 1MBH50-060
PDF下载: 下载PDF文件 查看货源
内容描述: 600V / 50A塑模封装 [600V / 50A Molded Package]
分类和应用: 晶体晶体管双极性晶体管局域网
文件页数/大小: 5 页 / 228 K
品牌: FUJI [ FUJI ELECTRIC ]
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1MBH50-060, 1MBH50D-060
Characteristics
1MBH50-060,1MBH50D-060
Transient thermal resistance
IGBT Module
Thermal resistance : R
th (j-c)
[°C/W]
10
1
10
0
10
-1
10
-2
10
-4
10
-3
10
-2
Pulse width : P
W
[sec.]
10
-1
10
0
1MBH50D-060
Reverse recovery time vs. Forward current
-di/dt=150A /
µsec
400
Reverse recovery current vs. Forward current
-di/dt=150A /
µsec
15
300
reverse recovery time : trr [nsec]
reverse recovery current : Irr [A]
10
200
100
5
0
0
20
40
Forward current : I
F
[A]
60
80
0
0
20
40
Forward current : I
F
[A]
60
80
Forward current vs. Foeward voltage
500
100
Reverse recovery time characteristics vs. -di/dt
IF=50A
, Tj=125°C
25
400
80
20
reverse recovery time : trr [nsec]
300
15
60
Forward current : I
F
[A]
40
200
10
20
100
5
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
100
200
-di/dt
300
[ A / µsec ]
400
500
Forward voltage : V
F
[V]
0
reverse recovery current : Irr [A]