5. Thermal resistance characteristics
Items
Thermal resistance(1device)
Symbols
Rth(j-c)
IGBT
FWD
Conditions
Characteristics
min.
typ.
max.
-
-
0.24
-
-
0.39
Units
o
Contact Thermal resistance
Rth(c-f)
with Thermal Compound
-
0.05
-
(1 device) (*5)
(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.
C/W
6. Indication on module
Logo of production
6MBI100U4B-120
100A 1200V
Lot.No.
7. Applicable category
Place of manufacturing (code)
This specification is applied to IGBT-Module named 6MBI100U4B-120.
8. Storage and transportation notes
• The module should be stored at a standard temperature of 5 to 35
o
C and humidity of 45 to 75% .
• Store modules in a place with few temperature changes in order to avoid condensation on the
module surface.
• Avoid exposure to corrosive gases and dust.
• Avoid excessive external force on the module.
• Store modules with unprocessed terminals.
• Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
�½�
�½�
90%
0V
L
0V
V
GE
t
r r
I
r r
90%
�½�
�½�
V
CE
Vcc
Ic
90%
R
G
V
GE
V
CE
Ic
0V
0A
t
r ( i )
t
r
t
o n
t
o f f
�½�
�½�
Ic
10%
10%
V
CE
t
f
10%
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
MS5F6012
5
13
H04-004-03a
FUJI [ FUJI ELECTRIC ]
