FOR BOARD-TO-BOARD CONNECTION
240 SERIES (LOW-PROFILE STACKING)
s
FEATURES
• The connectors can connect boards in parallel
(stacking) at intervals of 8 mm (0.31 in.) to 14 mm
(0.55 in.) for various applications.
• Connectors with ten different numbers of contacts are
available for various purposes: 20 to 100 in steps of
ten and 120.
• Connectors are surface mount compatible.
• 1.27 mm (0.050 in.) pitch contact arrangement in two
rows enables high-density mounting. Tails are spaced
in a four-row staggered arrangement (2.54 mm
×
1.905 mm) (0.100 in.
×
0.075 in.) for easy patterning
on PC boards.
• Bellows contacts ensure stable contact preventing
pins from bending. The bellows contacts also have
excellent stability with repeated insertion and
extraction.
s
SPECIFICATIONS
Item
Operating temperature range
Current rating
Voltage rating
Contact resistance
Insulation resistance
Dielectric withstand voltage
Specifications
–55°C to +105°C
DC 1 A
AC 250 V
35 mΩ max. (DC 6 V, 0.1 A)
1000 MΩ min. (DC 500 V)
AC 750 V for 1 minute
s
MATERIALS
Item
Insulator
Conductor
Plating
Materials
Polyamide resin (94V-0)
Copper alloy
Contact
Terminal
Gold plating (PAGOS)
Palladium plating
Specifications
subject to change
Dimensions are in millimeters (inches)
www.fcai.fujitsu.com
1
FUJITSU [ FUJITSU COMPONENT LIMITED. ]
