FTR-B2 Series
1. General Information
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RoHS Compliance and Lead Free Relay Information
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
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Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
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Most
signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
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It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
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“LF”
is marked on each outer and inner carton. (No marking on individual relays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
We will ship leaded relays as long as the leaded relay inventory exists.
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2.
Recommended Lead Free Solder Profile
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Reflow Solder condtion
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February
2005)
IS
C
O
N
250
Temperature ( C)
220
Pre-heating
TI
N
U
Soldering
Peak Temp.: max. 250 C
Flow Solder condtion:
Pre-heating:
Soldering:
170
130
30
ED
maximum 120˚C
dip within 5 sec.
at 260˚C solder bath
Solder by Soldering Iron:
Cooling
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
90~120 sec.
max. 120 sec.
20~30 sec.
(duration)
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
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Moisture Sensitivity Level standard is not applicable to electromechanical realys.
SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
test.
4. Tin Whisker
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FUJITSU [ FUJITSU COMPONENT LIMITED. ]
