MB3761
■
MB3761PF-❏❏❏E1 RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL
Item
Mounting Method
Mounting times
Before opening
Storage period
From opening to the 2nd
reflow
When the storage period after
opening was exceeded
Storage conditions
Condition
IR (infrared reflow) , Manual soldering (partial heating method)
2 times
Please use it within two years after
Manufacture.
Less than 8 days
Please processes within 8 days
after baking (125
°C,
24H)
5
°C
to 30
°C,
70%RH or less (the lowest possible humidity)
[Temperature Profile for FJ Standard IR Reflow]
(1) IR (infrared reflow)
H rank : 260
°C
Max
260
°C
255
°C
170
°C
~
190
°C
RT
(b)
(c)
(d)
(e)
(a)
(d')
(a) Temperature Increase gradient
(b) Preliminary heating
(c) Temperature Increase gradient
(d) Actual heating
(d’)
(e) Cooling
: Average 1
°C/s
to 4
°C/s
: Temperature 170
°C
to 190
°C,
60s to 180s
: Average 1
°C/s
to 4
°C/s
: Temperature 260
°C
Max; 255
°C
or more, 10s or less
: Temperature 230
°C
or more, 40s or less
or
Temperature 225
°C
or more, 60s or less
or
Temperature 220
°C
or more, 80s or less
: Natural cooling or forced cooling
Note : Temperature : the top of the package body
(2) Manual soldering (partial heating method)
Conditions : Temperature 400
°C
Max
Times
: 5 s max/pin
13
FUJITSU [ FUJITSU COMPONENT LIMITED. ]
