GO1525 Data Sheet
3.1 Reflow Conditions
The device will meet the data sheet specifications after completing the reflow
process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended
soldering conditions are as follows:
Preheating
Soldering
150±10°C, 60 to 120 sec.
Peak 260°C
Over 200°C within 30 sec.
3.2 Soldering Flux
Do not use cleaning type flux. Washing the devices after using cleaning type flux
may damage inner parts and affect performance.
3.3 Rework or Repair
Rework or repair must only be done once. Do not reflow the device more than
twice; once for initial soldering and once for remounting after rework.
Do not vibrate the VCO during reflow soldering.
3.4 Endurance To Warp
When the device is soldered on a printed circuit board (dimension: 100mm x
100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the
device will not be cracked or damaged.
VCO
PCB
MAX 2mm
Figure 3-3: PCB Warp
21969 - 9 February 2007
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GENNUM [ GENNUM CORPORATION ]
