Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(continued)
SOT-223 Max. Power Dissipation
vs. PCB Top Copper Area
T
AMB
= 25
°
C ; Still Air
3
Max. Dissipation Power (W)
2.5
2
1.5
1
0.5
0
0.5
1.5
2.5
3.5
4.5
PCB Top Copper Area (in
2
)
3
2.5
2
1.5
1
0.5
0
25
35
45
G910/G911
SOT-223 Max. Power Dissipation
vs. T
AMB
(still air)
( Different PCB Top Copper Area )
Unit:in
2
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
Max. Dissipation Power (W)
55
T
AMB
(
°
C)
65
75
85
SOT-89 Max. Power Dissipation
vs. PCB Top Copper Area
T
AMB
= 25
°
C ; Still Air
3
2.5
2
1.5
1
0.5
0
0.5
1.5
2.5
3.5
PCB Top Copper Area (in
2
)
4.5
3
2.5
2
1.5
1
0.5
0
25
SOT-89 Max. Power Dissipation
vs. T
AMB
(still air)
( Different PCB Top Copper Area )
Unit:in
2
A=0.5
Max. Dissipation Power (W)
Max. Dissipation Power (W)
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
45
T
AMB
(
°
C)
65
85
Recommended Minimum Footprint
SOT-89
SOT-223
Ver: 7.2
Jan 20, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
6
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
