BYV27-150GE
GLASS PASSIVATED JUNCTION
ULTRAFAST EFFICIENT SILICON RECTIFIER
VOLTAGE：150V
CURRENT： 2.0A
DO-15/DO-204AC
FEATURE
Low power loss
High surge capability
Glass passivated chip junction
Ultra-fast recovery time for high efficiency
High temperature soldering guaranteed
250℃/10sec/0.375″lead length at 5 lbs tension
MECHANICAL DATA
Terminal：Plated axial leads solderable per
MIL-STD 202E, method 208C
Case：Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity：color band denotes cathode
Mounting position：any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half -wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated)
SYMBOL
BYV27-150GE
units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Vrrm
Vrms
Vdc
150
105
150
V
V
V
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8″lead length at Ta =55℃
Peak Forward Surge Current 8.3ms single half sine-wave
superimposed on rated load
If(av)
Ifsm
2.0
A
A
50.0
Vf
0.98
V
Maximum Forward Voltage at Forward current 2.0A Peak
Ersm
20
5.0
mJ
Non-repetitive peak reverse avalanche energy
(Note 1)
Maximum DC Reverse Current
at rated DC blocking voltage
Ta =25℃
Ta =125℃
Ir
ꢀA
150.0
25
Trr
Cj
nS
pF
Maximum Reverse Recovery Time
Typical Junction Capacitance
(Note 2)
(Note 3)
15
Typical Thermal Resistance
(Note 4)
Rth(ja)
Tstg,Tj
45
℃/W
℃
Storage and Operating Junction Temperature
-55 to +150
Note: 1.L = 120 mH; Tj = Tj max prior to surge; inductive load switched off.
2.Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
3.Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
4.Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A1
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