GBU8A THRU
GBU8M
SINGLE PHASE GLASS
PASSIVATED BRIDGE RECTIFIER
Voltage: 50
to
1000V
8.0A
Current:
Features
Ideal for printed circuit board
Glass passivated chip junction
High case dielectric strength
High surge overload rating
This series is UL listed under Recognized Component Index,
file number E185029
GBU
Mechanical Data
Terminal: Plated leads solderable per MIL-STD 202E, method
208C
Case: UL-94 Class V-0 recognized Flame Retardant Epoxy
Polarity: Polarity symbol marked on body
Mounting position: Thru hole for #6 screw
Dimensions in millimeters
MAXIMUM
RATINGS AND ELECTRICAL
CHARACTERISTICS
(single-phase, half -wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated,
for capacitive load, derate current by 20%)
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified output current at Tc =
100℃
(Note 1)
Peak forward surge current single sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage drop per leg at 8.0A
Rating for fusing (t < 8.3ms)
Maximum DC reverse current at
rated DC blocking voltage per leg
Typical junction capacitance per leg at 4V,1MHz
Maximum thermal resistance per leg
Operating junction and storage temperature range
(Note3)
Ta = 25°
C
Ta = 125°
C
Vrrm
Vrms
Vdc
If(av)
Ifsm
Vf
I
2
t
Ir
Cj
Rth(ja)
Rth(jc)
Tj, Tstg
211
21
2.2
-55 to +150
GBU
8A
50
35
50
GBU
8B
100
70
100
GBU
8D
200
140
200
GBU
8G
400
280
400
8.0
200
1.0
166
5.0
500
94
GBU
8J
600
420
600
GBU
8K
800
560
800
GBU
8M
1000
700
1000
units
V
V
V
A
A
V
A
2
Sec
µA
pF
℃/W
℃
Note:
1. Unit case mounted on 3.2 x 3.2 x 0.12” thick (8.2 x8.2 x 0.3cm) Al. Plate heatsink
2. Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw
3. Units mounted in free air, no heatsink on P.C.B. with 0.5 x 0.5" (12 x 12mm) copper pads, 0.375" (9.5mm) lead length
Rev.A3
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GULFSEMI [ GULF SEMICONDUCTOR ]
