GUF15A THRU GUF15M
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
VOLTAGE:50 TO 1000V
CURRENT: 1.5A
DO-15\DO-204AC
FEATURE
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.2µA
Low power loss, high efficient
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E,method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
GUF
15A
50
GUF
15B
100
GUF
15D
GUF
15F
GUF
15G
GUF
15J
GUF
15K
GUF
15M
SYMBOL
units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Vrrm
Vrms
Vdc
200
140
200
300
210
300
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
35
50
70
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
Current and 25°C
Maximum full load reverse current full cycle
average at 55°C Ambient
100
1000
If(av)
Ifsm
Vf
1.5
50
A
A
V
1.1
1.4
100
1.7
Ir(av)
µ
A
5
µ
µ
nS
pF
A
A
Maximum DC Reverse Current
at rated DC blocking voltage
Typical Reverse Recovery Time
Ta =25°C
Ta =125°C
(Note 1)
Ir
100
Trr
Cj
50
40
75
50
Typical Junction Capacitance
(Note 2)
°C
/W
Typical Thermal Resistance
(Note 3)
R(ja)
20
Storage and Operating Temperature Range
Note:
Tstg, Tj
-65 to +175
°C
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A5
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GULFSEMI [ GULF SEMICONDUCTOR ]
