星合电子
XINGHE ELECTRONICS
FEATURES
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SF51G THRU SF58G
VOLTAGE RANGE
CURRENT
50 to 600 Volts
5.0 Ampere
Super fast switching speed
Glass passivated chip junction
Low power loss, high efficiency
Low leakage
High Surge Capacity
High temperature soldering guaranteed
260℃/10 seconds, 0.375″(9.5mm) lead length
DO-27
.052(1.3)
.048(1.2)
DIA.
1.0(25.4)
MIN.
.375(9.5)
.335(8.5)
.220(5.6)
DIA.
.197(5.0)
1.0(25.4)
MIN.
MECHANICAL DATA
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Case: Transfer molded plastic
Epoxy: UL94V-0 rate flame retardant
Polarity: Color band denotes cathode end
Lead: Plated axial lead, solderable per MIL-STD-202E method 208C
Mounting position: Any
Weight: 0.042ounce, 1.19 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load
For capacitive load derate current by 20%
SF
SF
SYMBOLS
51G
52G
Maximum Repetitive Peak Reverse Voltage
V
RRM
50
100
Maximum RMS Voltage
V
RMS
35
70
Maximum DC Blocking Voltage
V
DC
50
100
Maximum Average Forward Rectified Current
0.375”(9.5mm) lead length at T
A
=55℃
Peak Forward Surge Current
8.3mS single half sine wave superimposed on
rated load (JEDEC method)
Maximum Instantaneous Forward Voltage at 5.0A
Maximum DC Reverse Current
at rated DC blocking Voltage at
T
A
= 25℃
T
A
= 125℃
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SF
53G
150
105
100
SF
54G
200
140
200
5.0
125
SF
55G
300
210
300
SF
56G
400
280
400
SF
57G
500
350
500
SF
58G
600
420
600
UNIT
Volts
Volts
Volts
Amps
Amps
I
(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θJA
T
J
T
STG
50
0.95
1.25
5.0
50
35
30
30
(-55 to +150)
(-55 to +150)
1.7
Volts
µA
nS
pF
℃
/W
℃
℃
Maximum Reverse Recovery Time
Test conditions l
F
= 0.5A, l
R
= 1.0A, l
RR
=0.25A
Typical Junction Capacitance
(Measured at 1.0MHz and applied reverse voltage of 4.0V)
Typical Thermal Resistance (NOTE 1)
Operating Junction Temperature Range
Storage Temperature Range
Notes:
1. Thermal Resistance from Junction to Ambient with 0.375″(9.5mm) lead length, PCB mounted.
1
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