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DG200BA 参数 Datasheet PDF下载

DG200BA图片预览
型号: DG200BA
PDF下载: 下载PDF文件 查看货源
内容描述: CMOS双路/四路SPST模拟开关 [CMOS Dual/Quad SPST Analog Switches]
分类和应用: 开关输出元件
文件页数/大小: 8 页 / 94 K
品牌: HARRIS [ HARRIS CORPORATION ]
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DG200
Metallization Topology
DIE DIMENSIONS:
74 x 77 x 14
±
1mils
METALLIZATION:
Type: Al
Thickness: 10k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
/Si
3
N
4
SiO
2
Thickness: 7k
Å
±
1.4k
Å
Si
3
N
4
Thickness: 8k
Å
±
1.2k
Å
WORST CASE CURRENT DENSITY:
1 x 10
5
A/cm
2
Metallization Mask Layout
DG200
D
1
(9)
V-
(7)
D
2
(6)
S
1
(10)
(5) S
2
V- (SUBSTRATE)* (12)
(14)
IN
1
* Backside of Chip is V+
(1)
IN
2
(3)
GND
9-19