HGTD3N60C3, HGTD3N60C3S
TO-251AA
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
E
A
INCHES
MIN
MILLIMETERS
SYMBOL
MAX
0.094
0.022
0.032
0.040
0.215
0.022
0.290
0.265
MIN
2.19
0.46
0.72
0.84
5.21
0.46
6.86
6.35
MAX
2.38
0.55
0.81
1.01
5.46
0.55
7.36
6.73
NOTES
b2
A
H
1
1
A
0.086
0.018
0.028
0.033
0.205
0.018
0.270
0.250
-
TERM. 4
A
1
3, 4
SEATING
PLANE
D
b
3, 4
b
b
3
1
3, 4
2
c
3, 4
b1
D
E
e
-
-
L
1
L
c
b
0.090 TYP
0.180 BSC
2.28 TYP
4.57 BSC
5
5
-
e
1
1
2
3
H
0.035
0.045
0.045
0.375
0.090
0.89
1.14
1.14
9.52
2.28
1
J
e
1
J
0.040
0.355
0.075
1.02
9.02
1.91
6
-
1
e1
L
LEAD 1
LEAD 2
LEAD 3
TERM. 4
-
-
-
-
GATE
L
2
1
COLLECTOR
EMITTER
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
COLLECTOR
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 10-95.
7
HARRIS [ HARRIS CORPORATION ]
