LED LAMP APPLICATION
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
DIP
Bath temperature: 260±5℃
SOLDERING
Immersion time: with 5 sec
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
T
emperature at tip of iron: 260℃ or lower (To prevent heat from being Soldering time: within 5 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave
a
slight
clearance
(Fig.2)
Page : 5
HB [ HB ELECTRONIC COMPONENTS ]
