LED
SOLDERING
METHOD
LAMP
APPLICATION
SOLDERING CONDITIONS
REMARK
Solder no closer than 3mm from the
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
DIP
SOLDERING
Bath temperature: 260±5℃
Immersion time: with 5 sec
During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260
℃
or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
L e a d w r i e s
P a n e l
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
L e a d
w r i e s
L e a v e
a s l i g h t
c l e a r a n c e
(Fig.2)
Page :
5
HB [ HB ELECTRONIC COMPONENTS ]
