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560MW7C 参数 Datasheet PDF下载

560MW7C图片预览
型号: 560MW7C
PDF下载: 下载PDF文件 查看货源
内容描述: LED规格 [LED SPECIFICATION]
分类和应用:
文件页数/大小: 10 页 / 777 K
品牌: HB [ HB ELECTRONIC COMPONENTS ]
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LED LAMP APPLICATION  
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to  
avoid steering the leads (See Fig.3).  
PC board  
Fig.3  
jig  
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to  
preserve the soldering conditions with irons stated above: select a best-suited method that  
assures the least stress to the LED.  
5) Lead cutting after soldering should be performed only after the LED temperature has returned to  
normal temperature.  
yLED MOUNTING METHOD  
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on  
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective  
components including the LED should be taken into account especially when designing the  
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the  
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the  
shape of the holes should be made oval. (See Fig.4)  
case  
pc board  
Fig.4  
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