Multilayer Type Mini Speaker
Industry-thinnest contributes miniaturization of application.
Featues
Mini, Ultra Thin ( 20 0.6t), yet High Sound Pressure
Solder-less Construction by HDK Printing Technology
Using High Reliability Multilayer Vibrating Plate by HDK-developed
High-efficient LTC Piezo material
Applications
Digital Still Camera, Digital Video Camera, MD(Mini Disk),
Cell Phone, Electronic Dictionary, Game, etc.
Outer Dimension
Chassis mounting side
20
(1
9.
6)
18
.5
15
(
)
0.1
(15)
(1)
22.5
12
0.1
* More than 0.5mm of open spaces in front of and rear of speaker is recommended to provide.
Rating
Model No.
HAP-BME-20-13N01
Sound Pressure
Resonant Frequency
Static Capacitance
Rated Input Voltage
Maximum Input Voltage
Operating Temperature Range
Storage Temperature Range
72dB at 1Vrms Sine Wave, Mic. Distance 10cm,
Sound Pressure averaging at 0.8k, 1k, 1.5k, 2kHz
1,050Hz 1,450Hz
950nF 30%
1Vrms (2.8Vp-p)
10Vp-p
-20
+60
-30
+70
Frequency Characteristics (Example)
Input Voltage 1Vrms Sine Wave Mic. Distance 10cm
Sound Pressure ( B)
100
90
80
70
60
50
100
1000
Frequency (H )
10000
HOKURIKU
Specifications are subject to change without notice.
2.5
0.6
2
HOKURIKU [ HOKURIKU ELECTRIC INDUSTRY CO.,LTD ]
