Double Sided (Silver / Copper) Polymer Through Hole Board
Features
Significant cost reduction is possible by replacing copper plating through-hole PWB with polymer through-hole PWB.
High density circuit design is widely available.
Double sided surface mount PWB is available by using polymer through-hole PWB.
Highly reliable PWB is realized by using polymer through-holes on paper phenolic board.
Construction
No.
Name
Base
Copper Foil
Through-hole
No.
Name
Solder Resist
Covercoat & Marking
Through-hole Pitch
(mm)
Design Requirement
Through-hole
A
D
B C
E
Copper Foil
F
Specification
Item
Material of Base
Through-hole
Ambient Temperature
Through-hole Resistance
Rated Current
Max. Operation Voltage
Load Life
Humidity Load Life
High Temperature
Humidity
Solder Dipping
Reflow
Migration
Oil Dipping
Heat Cycle
Through-hole Pitch:A
1.00
1.25
1.50
1.75
2.00
2.50
C
0.80
1.00
1.20
1.40
1.50
2.00
D
0.20
0.25
0.30
0.35
0.50
0.50
E
0.25
0.25
0.30
0.40
0.50
0.50
F
0.20
0.20
0.20
0.20
0.20
0.20
G
0.20
0.20
0.20
0.20
0.20
0.20
G
Specification
AgTh
FR-1, CEM-3
Conductive Resin
Silver Paste
Copper Paste
-30 ~ +100
100m /hole
300mA/hole
50V *(20V)
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
100m /hole
300mA/hole
100V
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
200m /hole
Copper paste through-hole pitch:
Min. 1.25mm
CuTh
Condition
Less than 1.25mm pitch:250mA/hole
Different electric potential Voltage
(*Applied less than 1.25mm pitch)
70
40
100
40
260
240
40
260
-40
1000Hr
90~ 95%RH 1000Hr
1000Hr
90~ 95%RH 1000Hr
5sec.
3sec.
90 ~ 95%RH 1000Hr
10sec 100 Cycle
100
30min. 100 cycle
HOKURIKU
Specifications are subject to change without notice.
1