HT46R47
Pin Description
Pin No.
4~2
1
18
17
16, 15
Pin Name
PA0~PA2
PA3/PFD
PA4/TMR
PA5/INT
PA6, PA7
I/O
ROM Code
Option
Description
Bidirectional 8-bit input/output port. Each bit can be
configured as wake-up input by ROM code option.
Pull-high Software instructions determine the CMOS output or
I/O
Wake-up Schmitt trigger input with or without pull-high resistor
PA3 or PFD (determined by pull-high options: bit option). The PFD,
TMR and INT are pin-shared with PA3, PA4 and PA5,
respectively.
Bidirectional 4-bit input/output port. Software in-
structions determine the CMOS output, Schmitt trig-
ger input with or without pull-high resistor
(determined by pull-high options: bit option) or A/D in-
put.
Once a PB line is selected as an A/D input (by using
software control), the I/O function and pull-high
resistor are disabled automatically.
Negative power supply, ground.
Bidirectional I/O line. Software instructions deter-
mine the CMOS output, Schmitt trigger input with or
without a pull-high resistor (determined by pull-high
options: bit option). The PWM output function is
pin-shared with PD0 (dependent on PWM options).
Schmitt trigger reset input. Active low.
Positive power supply
OSC1, OSC2 are connected to an RC network or a
Crystal (determined by ROM code option) for the in-
ternal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
8
7
6
5
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
I/O
Pull-high
9
VSS
¾
¾
Pull-high
PD0 or
PWM
¾
¾
Crystal
or RC
10
PD0/PWM
I/O
11
12
13
14
RES
VDD
OSC1
OSC2
I
¾
I
O
Absolute Maximum Ratings
Supply Voltage ...............V
SS
-0.3V
to V
SS
+5.5V
Input Voltage.................V
SS
-0.3V
to V
DD
+0.3V
Storage Temperature ................-50°C to 125°C
Operating Temperature ..............-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under
²Absolute
Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
Rev. 1.40
3
July 18, 2001
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
