HT75XX
Pad Assignment
Pad Coordinates
Pad No.
1
2
3
(0 ,0 )
Unit:
mm
X
Y
-589.50
-582.50
-585.50
-506.50
61.00
510.50
1
G N D
2
3
V IN
Chip size: 1390
´
1530 (mm)
2
*The IC substrate should be connected to VDD in the PCB layout artwork.
V O U T
Absolute Maximum Ratings
Supply Voltage...............................-0.3V to 26V
Power Consumption.............................. 250mW
Storage Temperature.................-50°C to 125°C
Operating Temperature ..................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under
²Absolute
Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
3
May 2, 2000
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
